frequency range mhz mean delay* (ns) phase deviation (degrees max) amplitude flatness (db p-p) 869 - 894 11.25 0.2 0.5 0.15 return loss (db min) insertion loss (db min) power handling (watts) rf interface size/outline (inches - l,w,h) 20 4.6 15 surface mount 1.0 x 1.0 x 0.18 specifications are based upon unit mounted on printed circuit board with 50 ohm nominal impedance. *mean delay refers to the group delay of the applied input signal through the network. the specified tolerance relates to unit -unit group delay variation. multi-mix ? delay lines fea tures applica tions ? 869 - 894 mhz ? amps ? low loss ? base station power amplifier ? low vswr linearization networks ? surface mount ? feed forward ? low cost ? pre-distortion ? adaptive interference cancellation the dll-113r-0.88g, a member of the multi-mix ? dll family of delay lines, provides a mean delay of 11.25 ns in the amps band and features low insertion loss and low vswr. the dll-113r-0.88g exhibits excellent phase linearity and amplitude flatness over the 869 - 894 mhz frequency range. the multi-mix ? dll-113r-0.88g is intended for use in power amplifier linearization networks such as feedforward and predistortion. dll delay lines are fusion bonded multilayer stripline structures. the dll series offers an excellent alter- native to expensive coaxial and delay filter structures. the fusion bonding process yields a homgeneous monolithic dielectric structure with reliability, ruggedness and electrical and thermal performance that is superior to conventional adhesive bonding techniques. delay line dll-113r-0.88g technical description preliminary rev: 006, 12/02/04 the multi-mix microtechnology ? group is iso 9001:2000 registered merrimac industries / 41 fairfield place, west caldwell, nj 07006 tel: 1.888.434.mmfm / fax: 973.882.5990 / email: mmfm@merrimacind.com / www.multi-mix.com u.s. patent 6,099,677 and other patents pending. general specifications package outline / mounting configuration 0.168 [4.28] 12 2x 0.057 [1.45] 2x 0.057 [1.45] 0.109 [2.76] 2x 0.389 [9.87] 0.017 [0.43] r0.057 [r1.45] 2x r0 .057 [r1.4 5] pin 2 5x 0.037 [0.94] 1.000 [25.40] 1.000 [25.40] 0.867 [22.02] 0.076 [1.93] sq 0.848 [21.54] hot via orientation marker denotes pin location gnd gnd pin 1 hot via hot via 3x hot via ground plane of unit should be soldered to ground plane of circuit board for optimum performance. 2x 0.076 [1.93] sq 2x 0.889 [22.58] 2x 0.869 [22.07] 2x 0.062 [1.57] ground plane 2x 0.069 [1.77] 50 ohm line .032 dielectric thickness er = 3.38 0.021 [0.52] 0.400 [10.16] 0.089 [2.26] 0.013 [0.33] 3x 0.037 [0.94] 2x 0.037 [0.94] 0.848 [21.54] 2x r 0.0 55 [r 1.40] r0.045 [r1.14]
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